| PART |
Description |
Maker |
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| WDFN2X2-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| LQFP44 |
Package outline
|
Philips
|
| WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
| TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
